Difference between revisions of "Stress Enhancement in the Delayed Yielding of Colloidal Gels"

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quantitatively describes this behavior and highlights the role of mesoscopic structures. Our result gives
 
quantitatively describes this behavior and highlights the role of mesoscopic structures. Our result gives
 
new insight into the nature of yielding in these soft solid materials.
 
new insight into the nature of yielding in these soft solid materials.
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[[Image:/Users/Bryan/Desktop/Harvard/AP 255 Condensed Soft Matter/Wiki Papers/Images/Fig1_Stress_Enhancement.jpg|600px|right|thumbnail|Fig. 1. Experimental and theoretical plots for R/R_o - L/L_o relation: (left)for Cu/Kapton film (right)for Cu/Cr/Kaption film]]

Revision as of 17:45, 11 September 2011

Introduction

Networks of aggregated colloidal particles are solidlike and can sustain an applied shear stress while exhibiting little or no creep; however, ultimately they will catastrophically fail. We show that the time delay for this yielding decreases in two distinct exponential regimes with applied stress. This behavior is universal and found for a variety of colloidal gel systems. We present a bond-rupture model that quantitatively describes this behavior and highlights the role of mesoscopic structures. Our result gives new insight into the nature of yielding in these soft solid materials.

File:/Users/Bryan/Desktop/Harvard/AP 255 Condensed Soft Matter/Wiki Papers/Images/Fig1 Stress Enhancement.jpg
Fig. 1. Experimental and theoretical plots for R/R_o - L/L_o relation: (left)for Cu/Kapton film (right)for Cu/Cr/Kaption film